Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8410587 | Integrated circuit package system | Taesung Lee, Jae Soo Lee | 2013-04-02 |
| 8405230 | Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof | Jae Soo Lee, Sheila Marie L. Alvarez, Robinson Quiazon, Hin Hwa Goh, Frederick R. Dahilig | 2013-03-26 |
| 7880313 | Semiconductor flip chip package having substantially non-collapsible spacer | Jae Soo Lee, Sheila Marie L. Alvarez, Robinson Quiazon, Hin Hwa Goh, Frederick R. Dahilig | 2011-02-01 |
| 7785925 | Integrated circuit packaging system with package stacking and method of manufacture thereof | — | 2010-08-31 |
| 7671451 | Semiconductor package having double layer leadframe | Jason Lee | 2010-03-02 |
| 7615851 | Integrated circuit package system | Taesung Lee, Jae Soo Lee | 2009-11-10 |
| 6427291 | Buckle | — | 2002-08-06 |