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Electronic and atomic structure computation utilizing machine learning |
— |
2023-02-21 |
| 11537898 |
Generative structure-property inverse computational co-design of materials |
Harsono S. Simka |
2022-12-27 |
| 11289419 |
Interconnects having long grains and methods of manufacturing the same |
Jorge A. Kittl, Harsono S. Simka |
2022-03-29 |
| 11087055 |
Method of screening materials using forward conducting modes |
Harsono S. Simka, Chris Bowen |
2021-08-10 |
| 11043454 |
Low resistivity interconnects with doped barrier layer for integrated circuits |
Harsono S. Simka |
2021-06-22 |
| 10916513 |
Method and system for providing a reverse engineering resistant hardware embedded security module |
Harsono S. Simka, Joon Goo Hong, Rwik Sengupta, Mark S. Rodder |
2021-02-09 |
| 10763207 |
Interconnects having long grains and methods of manufacturing the same |
Jorge A. Kittl, Harsono S. Simka |
2020-09-01 |
| 10510886 |
Method of providing reacted metal source-drain stressors for tensile channel stress |
Jorge A. Kittl |
2019-12-17 |
| 10510665 |
Low-k dielectric pore sealant and metal-diffusion barrier formed by doping and method for forming the same |
Mark S. Rodder, Jorge A. Kittl, Chris Bowen |
2019-12-17 |
| 10381315 |
Method and system for providing a reverse-engineering resistant hardware embedded security module |
Harsono S. Simka, Joon Goo Hong, Rwik Sengupta, Mark S. Rodder |
2019-08-13 |
| 10311179 |
Physical modeling of electronic devices/systems |
Gerhard Klimeck, Mykhailo Povolotskyi, Tillmann Kubis |
2019-06-04 |
| 10297673 |
Methods of forming semiconductor devices including conductive contacts on source/drains |
Jorge A. Kittl, Rwik Sengupta, Borna J. Obradovic, Mark S. Rodder |
2019-05-21 |
| 10283638 |
Structure and method to achieve large strain in NS without addition of stack-generated defects |
Jorge A. Kittl, Robert C. Bowen, Mark S. Rodder |
2019-05-07 |
| 10061877 |
Physical modeling of electronic devices/systems |
Gerhard Klimeck, Mykhailo Povolotskyi, Tillmann Kubis |
2018-08-28 |
| 9858365 |
Physical modeling of electronic devices/systems |
Gerhard Klimeck, Mykhailo Povolotskyi, Tillmann Kubis |
2018-01-02 |
| 9831323 |
Structure and method to achieve compressively strained Si NS |
Jorge A. Kittl, Robert C. Bowen, Borna J. Obradovic, Mark S. Rodder |
2017-11-28 |
| 9728502 |
Metal oxysilicate diffusion barriers for damascene metallization with low RC delays and methods for forming the same |
Mark S. Rodder, Rwik Sengupta, Chris Bowen |
2017-08-08 |
| 9634140 |
Fabricating metal source-drain stressor in a MOS device channel |
Jorge A. Kittl, Mark S. Rodder |
2017-04-25 |
| 9613907 |
Low resistivity damascene interconnect |
Mark S. Rodder, Jorge A. Kittl, Robert C. Bowen |
2017-04-04 |
