Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429144 | Integrated circuit manufacture method with aqueous hydrogen fluoride and nitric acid oxide etch | Landon B. Vines, Yu-Pin Han | 2002-08-06 |
| 6007641 | Integrated-circuit manufacture method with aqueous hydrogen-fluoride and nitric-acid oxide etch | Landon B. Vines, Yu-Pin Han | 1999-12-28 |
| 5745990 | Titanium boride and titanium silicide contact barrier formation for integrated circuits | Chang-Ou Lee, Landon B. Vines, Sigmund Koenigseder | 1998-05-05 |
| 5610105 | Densification in an intermetal dielectric film | Landon B. Vines, Sigmund Koenigseder, John L. Cain, Chang-Ou Lee | 1997-03-11 |
| 5493926 | Method of identifying a weakest interface where delamination is most likely to occur in a multi-layer dielectric film stack | Landon B. Vines, Danny Echtle, Annette Garcia | 1996-02-27 |
| 5493132 | Integrated circuit contact barrier formation with ion implant | Hunter B. Brugge, Kuang-Yeh Chang, Chang-Ou Lee, Walter D. Parmantie | 1996-02-20 |
| 5434104 | Method of using corrosion prohibiters in aluminum alloy films | John L. Cain, Landon B. Vines, Sigmund Koenigseder, Chang-Ou Lee | 1995-07-18 |
| 5329161 | Molybdenum boride barrier layers between aluminum and silicon at contact points in semiconductor devices | Landon B. Vines, John L. Cain, Chang-Ou Lee, Sigmund Koenigseder | 1994-07-12 |
| 5294571 | Rapid thermal oxidation of silicon in an ozone ambient | Chang-Ou Lee, Landon B. Vines | 1994-03-15 |
| 5286518 | Integrated-circuit processing with progressive intermetal-dielectric deposition | John L. Cain, Chang-Ou Lee, Sigmund Koenigseder, Landon B. Vines | 1994-02-15 |