Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9171784 | Dual power converter package using external driver IC | Dan Clavette | 2015-10-27 |
| 9159703 | Power converter package including vertically stacked driver IC | Andrew N. Sawle, Mark Pavier, Daniel Cutler | 2015-10-13 |
| 9111776 | Power semiconductor package with non-contiguous, multi-section conductive carrier | — | 2015-08-18 |
| 9111921 | Semiconductor package with conductive carrier integrated heat spreader | Andrew N. Sawle, Mark Pavier, Daniel Cutler | 2015-08-18 |
| 9099452 | Semiconductor package with low profile switch node integrated heat spreader | Dan Clavette | 2015-08-04 |
| 9048230 | Half-bridge package with a conductive clip | Chuan Cheah, Andrew N. Sawle | 2015-06-02 |
| 9041175 | Monolithic power converter package | Dean Fernando, Tim Philips, Dan Clavette | 2015-05-26 |
| 8987883 | Semiconductor package with multiple conductive clips | Chuan Cheah | 2015-03-24 |
| 8987051 | Thermally enhanced semiconductor package with conductive clip | — | 2015-03-24 |
| 8970021 | Thermally enhanced semiconductor package | — | 2015-03-03 |
| 8901742 | Monolithic Power Converter Package with Through Substrate vias | Dean Fernando, Tim Philips, Dan Clavette | 2014-12-02 |
| 8896107 | High power semiconductor package with conductive clip | Chuan Cheah | 2014-11-25 |
| 8749034 | High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor | Chuan Cheah | 2014-06-10 |
| 8680627 | Stacked half-bridge package with a common conductive clip | Chuan Cheah, Andrew N. Sawle | 2014-03-25 |
| 8680661 | Direct contact package for power transistors | — | 2014-03-25 |
| 8674497 | Stacked half-bridge package with a current carrying layer | Chuan Cheah, Andrew N. Sawle | 2014-03-18 |
| 8664754 | High power semiconductor package with multiple conductive clips | Chuan Cheah | 2014-03-04 |
| 8614503 | Common drain exposed conductive clip for high power semiconductor packages | — | 2013-12-24 |
| 8575736 | Direct contact flip chip package with power transistors | — | 2013-11-05 |
| 8575737 | Direct contact semiconductor package with power transistor | — | 2013-11-05 |
| 8531016 | Thermally enhanced semiconductor package with exposed parallel conductive clip | — | 2013-09-10 |
| 8497573 | High power semiconductor package with conductive clip on multiple transistors | Chuan Cheah | 2013-07-30 |
| 8497574 | High power semiconductor package with conductive clips and flip chip driver IC | Chuan Cheah | 2013-07-30 |
| 8445999 | Direct contact leadless package | — | 2013-05-21 |
| 8426952 | Stacked half-bridge package with a common conductive leadframe | Chuan Cheah, Andrew N. Sawle | 2013-04-23 |