Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7146596 | Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid | Thomas R. Bednar, Timothy W. Budell, Patrick H. Buffet, Alain Caron, James V. Crain, Jr. +2 more | 2006-12-05 |
| 6793500 | Radial contact pad footprint and wiring for electrical components | Timothy W. Budell, David B. Stone, Jerzy M. Zalesinski | 2004-09-21 |