EW

Enbo Wang

YC Yangtze Memory Technologies Co.: 13 patents #65 of 626Top 15%
Huawei: 5 patents #2,609 of 15,535Top 20%
Overall (All Time): #248,642 of 4,157,543Top 6%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
11894995 Data processing method and apparatus Mingdong Li, Yaoguang Wang, Longyu Cao 2024-02-06
11805643 Method of fabrication thereof a multi-level vertical memory device including inter-level channel connector Ruo Fang Zhang, Haohao Yang, Qianbing Xu, Yushi Hu, Qian Tao 2023-10-31
11737263 3D NAND memory device and method of forming the same Ruo Fang Zhang, Haohao Yang, Qianbing Xu, Yushi Hu, Fushan Zhang 2023-08-22
11716843 Method for forming contact structures in three-dimensional memory devices Han Yang, Fanqing Zeng, Fushan Zhang, Qianbing Xu 2023-08-01
11502094 Multi-level vertical memory device including inter-level channel connector Ruo Fang Zhang, Haohao Yang, Qianbing Xu, Yushi Hu, Qian Tao 2022-11-15
11145667 3D NAND memory device and method of forming the same Ruo Fang Zhang, Haohao Yang, Qianbing Xu, Yushi Hu, Fushan Zhang 2021-10-12
10937806 Through array contact (TAC) for three-dimensional memory devices Qian Tao, Yushi Hu, Zhenyu Lu, Li Xiao, Xiaowang Dai +8 more 2021-03-02
10892280 Inter-deck plug in three-dimensional memory device and method for forming the same Qianbin Xu, Haohao Yang, Yong Zhang, Jialan He 2021-01-12
10741578 Inter-deck plug in three-dimensional memory device and method for forming the same Qianbin Xu, Haohao Yang, Yong Zhang, Jialan He 2020-08-11
10714493 Semiconductor plug protected by protective dielectric layer in three-dimensional memory device and method for forming the same Haohao Yang, Yong Zhang, Ruo Fang Zhang, Fushan Zhang, Qianbin Xu 2020-07-14
10679985 Three-dimensional memory device having semiconductor plug formed using backside substrate thinning Shasha Liu, Li Xiao, Feng Lu, Qianbin Xu 2020-06-09
10665500 Methods of semiconductor device fabrication Sha Liu, Feng Lu, Li Xiao, Haohao Yang, Zhaosong Li 2020-05-26
10658378 Through array contact (TAC) for three-dimensional memory devices Qian Tao, Yushi Hu, Zhenyu Lu, Li Xiao, Xiaowang Dai +8 more 2020-05-19
10651193 Memory device and forming method thereof Li Xiao, Zhao Hui Tang, Qian Tao, Yu Ting Zhou, Sizhe Li +2 more 2020-05-12
10419991 Data transmission method and system, and related apparatus Bin Wang, Qiyong Zhao, Chenghui Peng 2019-09-17
10299164 Protocol stack adaptation method and apparatus Chenghui Peng, Qiyong Zhao, Bin Wang 2019-05-21
9900259 Data transmission method and related apparatus to compress data to be transmitted on a network Chenghui Peng, Ganghua Yang, Wenyuan Yong 2018-02-20
9602632 Content encoding pre-synchronization method, device and system Wei Zhang, Chenghui Peng 2017-03-21