Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581239 | Lead-free solder paste as thermal interface material | Ning-Cheng Lee, Runsheng Mao, Sihai Chen, David Bedner | 2023-02-14 |
| 10813228 | Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material | Lee C. Kresge, Ning-Cheng Lee | 2020-10-20 |