Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581239 | Lead-free solder paste as thermal interface material | Ning-Cheng Lee, Sihai Chen, Elaina Zito, David Bedner | 2023-02-14 |
| 10010981 | Materials having increased mobility after heating | Ning-Cheng Lee | 2018-07-03 |