Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581239 | Lead-free solder paste as thermal interface material | Ning-Cheng Lee, Runsheng Mao, Sihai Chen, Elaina Zito | 2023-02-14 |
| 11155687 | High Tg epoxy formulation with good thermal properties | Tarun Amla | 2021-10-26 |
| 10364332 | High Tg epoxy formulation with good thermal properties | Tarun Amla | 2019-07-30 |
| 9822227 | High Tg epoxy formulation with good thermal properties | Tarun Amla | 2017-11-21 |
| 8697864 | Flame retardant compositions with a phosphorated compound | William D. Varnell | 2014-04-15 |
| 8129456 | Flame retardant compositions with a phosphorated compound | William D. Varnell | 2012-03-06 |