Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581239 | Lead-free solder paste as thermal interface material | Ning-Cheng Lee, Runsheng Mao, Elaina Zito, David Bedner | 2023-02-14 |
| 9875983 | Nanomicrocrystallite paste for pressureless sintering | Ning-Cheng Lee | 2018-01-23 |
| 9190377 | Metal coating for indium bump bonding | Ning-Cheng Lee | 2015-11-17 |
| 9120930 | Heat dissipating paint with high thermal radiating capability | Ning-Cheng Lee | 2015-09-01 |