Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12240060 | SnIn solder alloys | Francis M. Mutuku, Hongwen Zhang | 2025-03-04 |
| 12090579 | High reliability lead-free solder alloys for harsh environment electronics applications | Weiping Liu | 2024-09-17 |
| 11999018 | SnBi and SnIn solder alloys | Francis M. Mutuku, Hongwen Zhang | 2024-06-04 |
| 11807536 | Method for preparing graphite sheets with piercing treatment to enhance thermal conduction | Hongtao Xia, Fen Chen | 2023-11-07 |
| 11752579 | High reliability leadfree solder alloys for harsh service conditions | Jie Geng, Hongwen Zhang | 2023-09-12 |
| 11738411 | Lead-free solder paste with mixed solder powders for high temperature applications | Hongwen Zhang, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis M. Mutuku | 2023-08-29 |
| 11712762 | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders | Hongwen Zhang, Fen Chen, Francis M. Mutuku, Jie Geng | 2023-08-01 |
| 11581239 | Lead-free solder paste as thermal interface material | Runsheng Mao, Sihai Chen, Elaina Zito, David Bedner | 2023-02-14 |
| 11413709 | High reliability lead-free solder alloys for harsh environment electronics applications | Weiping Liu | 2022-08-16 |
| 11267080 | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders | Hongwen Zhang, Fen Chen, Francis M. Mutuku, Jie Geng | 2022-03-08 |
| 11229979 | High reliability lead-free solder alloys for harsh environment electronics applications | Weiping Liu | 2022-01-25 |
| 10888958 | Hybrid high temperature lead-free solder preform | Hongwen Zhang, Joseph Wu, Jonathan Minter | 2021-01-12 |
| 10813228 | Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material | Lee C. Kresge, Elaina Zito | 2020-10-20 |
| 10756039 | Fluxes effective in suppressing non-wet-open at BGA assembly | Fengying Zhou, Fen Chen | 2020-08-25 |
| 10328533 | Hybrid lead-free solder wire | Hongwen Zhang | 2019-06-25 |
| 10118260 | Mixed alloy solder paste | Hongwen Zhang | 2018-11-06 |
| 10010981 | Materials having increased mobility after heating | Runsheng Mao | 2018-07-03 |
| 9875983 | Nanomicrocrystallite paste for pressureless sintering | Sihai Chen | 2018-01-23 |
| 9802274 | Hybrid lead-free solder wire | Hongwen Zhang | 2017-10-31 |
| 9741676 | Tin-indium based low temperature solder alloy | Jianguo Luo | 2017-08-22 |
| 9636784 | Mixed alloy solder paste | Hongwen Zhang | 2017-05-02 |
| 9260768 | Lead-free solder alloys and solder joints thereof with improved drop impact resistance | Weiping Liu | 2016-02-16 |
| 9190377 | Metal coating for indium bump bonding | Sihai Chen | 2015-11-17 |
| 9175368 | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability | Weiping Liu | 2015-11-03 |
| 9120930 | Heat dissipating paint with high thermal radiating capability | Sihai Chen | 2015-09-01 |