Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9017446 | Mixed alloy solder paste | Hongwen Zhang | 2015-04-28 |
| 8348139 | Composite solder alloy preform | Weiping Liu | 2013-01-08 |
| 7767418 | Polynucleotide encoding a novel TRP channel family member, LTRPC3, and splice variants thereof | Jian Chen, John Feder, Shujian Wu, Liana Lee, Michael A. Blanar | 2010-08-03 |
| 7749336 | Technique for increasing the compliance of tin-indium solders | Benlih Huang, Hong-Sik Hwang | 2010-07-06 |
| 7749340 | Technique for increasing the compliance of lead-free solders containing silver | Benlih Huang, Hong-Sik Hwang | 2010-07-06 |
| 7705133 | Antibodies which bind variants of the TRP channel family member, LTRPC3 | Jian Chen, Shujian Wu, Michael A. Blanar, Paul C. Levesque, Lucy Sun | 2010-04-27 |
| 7598348 | Adiponectin receptor variant, AdipoR2v2 | Jian Chen, Dong Cheng | 2009-10-06 |
| 7541434 | Polypeptide for a TRP channel family member, TRP-PLIK2, and splice variants | Jian Chen, Shujian Wu, Han Chang, Michael A. Blanar | 2009-06-02 |
| 7504481 | TRP channel family member, LTRPC3 polypeptides | Jian Chen, John Feder, Shujian Wu, Liana Lee, Michael A. Blanar | 2009-03-17 |
| 7459532 | Variants of the TRP channel family member, LTRPC3G | Jian Chen, Shujian Wu, Michael A. Blanar, Paul C. Levesque, Lucy Sun | 2008-12-02 |
| 7435808 | Polynucleotides encoding novel adiponectin receptor variant, AdipoR2v2 | Shujian Wu, Dong Cheng | 2008-10-14 |
| 7344882 | Polynucleotides encoding variants of the TRP channel family member, LTRPC3 | Jian Chen, Shujian Wu, Michael A. Blanar, Paul C. Levesque, Lucy Sun | 2008-03-18 |
| 7223557 | Polynucleotide encoding a TRP channel family member, TRP-PLIK2 | Jian Chen, John Feder, Shujian Wu, Han Chang, Liana M. Le +2 more | 2007-05-29 |
| 7017795 | Solder pastes for providing high elasticity, low rigidity solder joints | Yan Liu, Derrick Herron | 2006-03-28 |
| 6783057 | Anti-tombstoning solder alloys for surface mount applications | Benlih Huang | 2004-08-31 |
| 6677179 | Method of applying no-flow underfill | Wusheng Yin | 2004-01-13 |
| 6610559 | Integrated void-free process for assembling a solder bumped chip | Shanger Wang, Wushing Yin | 2003-08-26 |