WY

Wushing Yin

TA The Indium Corporation Of America: 1 patents #11 of 34Top 35%
📍 Plattsburgh, NY: #84 of 147 inventorsTop 60%
🗺 New York: #67,335 of 115,490 inventorsTop 60%
Overall (All Time): #3,520,936 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6610559 Integrated void-free process for assembling a solder bumped chip Shanger Wang, Ning-Cheng Lee 2003-08-26