Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401298 | Method and device for transferring a chip to a contact substrate | Ghassem Azdasht | 2016-07-26 |
| 8742571 | Diode array and method for producing a diode array | Thorsten Teutsch, Ghassem Azdasht, Siavash Tabrizi | 2014-06-03 |
| 8497578 | Terminal face contact structure and method of making same | Thorsten Teutsch | 2013-07-30 |
| 8431477 | Method for joining aligned discrete optical elements | Erik Beckert, Henrik Banse, Matthias Fettke | 2013-04-30 |
| 8361881 | Method for alternately contacting two wafers | Ghassem Azdasht | 2013-01-29 |
| 8256131 | Method and device for drying circuit substrates | Ghassem Azdasht | 2012-09-04 |
| 7932611 | Device for alternately contacting two wafers | Ghassem Azdasht | 2011-04-26 |
| 7926699 | Method and device for transferring a solder deposit configuration | Ghassem Azdasht | 2011-04-19 |
| 7882997 | Method and device for mutual contacting of two wafers | Ghassem Azdasht | 2011-02-08 |
| 7829817 | Device for removing solder material from a soldered joint | Paul Kasulke, Oliver Uebel, Lars Titerle | 2010-11-09 |
| 7762446 | Method and device for transferring a solder deposit configuration | Ghassem Azdasht | 2010-07-27 |
| 7481352 | Method for ablating points of contact (debumping) | Thorsten Teutsch | 2009-01-27 |
| 7121449 | Method and device for applying material to a workpiece | Paul Kasulke, Oliver Uebel, Lars Titerle | 2006-10-17 |
| 7087442 | Process for the formation of a spatial chip arrangement and spatial chip arrangement | Hans-Hermann Oppermann, Ghassem Azdasht, Paul Kasulke | 2006-08-08 |
| 7049213 | Method for producing a contact substrate and corresponding contact substrate | Ghassem Azdasht | 2006-05-23 |
| 7021517 | Method and device for applying pieces of material to a workpiece | Paul Kasulke, Oliver Uebel, Lars Titerle | 2006-04-04 |
| 7007834 | Contact bump construction for the production of a connector construction for substrate connecting surfaces | — | 2006-03-07 |
| 6955943 | Method for producing a substrate arrangement | Ghassem Azdasht | 2005-10-18 |
| 6955284 | Device for positioning a tool in relation to a workpiece | Paul Kasulke, Oliver Uebel, Lars Titerle | 2005-10-18 |
| 6915940 | Device for applying solder globules | Ghassem Azdasht | 2005-07-12 |
| 6720257 | Bump with basic metallization and method for manufacturing the basic metallization | — | 2004-04-13 |
| 6651891 | Method for producing contactless chip cards and corresponding contactless chip card | Rolf Aschenbrenner, Frank Ansorge, Paul Kasulke | 2003-11-25 |
| 6478906 | Method for bonding a flexible substrate to a chip | Ghassem Azdasht, Herbert Reichl | 2002-11-12 |
| 6407457 | Contact-bumpless chip contacting method and an electronic circuit produced by said method | Rolf Aschenbrenner, Hans-Hermann Oppermann, Ghassem Azdasht | 2002-06-18 |
| 6284639 | Method for forming a structured metallization on a semiconductor wafer | Rolf Aschenbrenner, Ghassem Azdasht, Andreas Ostmann, Gerald Motulla | 2001-09-04 |