Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358084 | Bonding head and bonding apparatus | Andrej Kolbasow, Thorsten Krause, Svetlana Milz | 2025-07-15 |
| 12349287 | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole | Andrej Kolbasow, Nico Lange | 2025-07-01 |
| 12171066 | Method for removing and repositioning electronic components connected to a circuit board | Andrej Kolbasow | 2024-12-17 |
| 12028987 | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole | Andrej Kolbasow, Nico Lange | 2024-07-02 |
| 12023756 | Method for removing electronic components connected to a circuit board | Andrej Kolbasow | 2024-07-02 |
| 11367709 | Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangement | Andrej Kolbasow | 2022-06-21 |
| 11217558 | Method and device for establishing a wire connection as well as a component arrangement having a wire connection | Andrej Kolbasow, Jan Hoffmann | 2022-01-04 |
| 8431477 | Method for joining aligned discrete optical elements | Erik Beckert, Henrik Banse, Elke Zakel | 2013-04-30 |