Andrej Kolbasow — 8 Patents at Pac Tech—Packaging Technologies Gmbh

Andrej Kolbasow has been granted 8 US patents while listed as an inventor at Pac Tech—Packaging Technologies Gmbh. The first was granted in 2022 and the most recent in December 2025. Andrej Kolbasow ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Andrej Kolbasow in Paulinenaue, DE.

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Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date
12485500	Method for monitoring a laser soldering process, and laser soldering system using a spectroscope device	Matthias Fettke, Timo Kubsch, Gero Bonow	2025-12-02
12358084	Bonding head and bonding apparatus	Matthias Fettke, Thorsten Krause, Svetlana Milz	2025-07-15
12349287	Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole	Matthias Fettke, Nico Lange	2025-07-01
12171066	Method for removing and repositioning electronic components connected to a circuit board	Matthias Fettke	2024-12-17
12028987	Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole	Matthias Fettke, Nico Lange	2024-07-02
12023756	Method for removing electronic components connected to a circuit board	Matthias Fettke	2024-07-02
11367709	Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangement	Matthias Fettke	2022-06-21
11217558	Method and device for establishing a wire connection as well as a component arrangement having a wire connection	Jan Hoffmann, Matthias Fettke	2022-01-04

Andrej Kolbasow — 8 Patents

Patents per Year

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