Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8686543 | 3D chip package with shielded structures | Albert Bergemont, Uppili Sridhar, Joseph P. Ellul, Yi-Sheng Anthony Sun | 2014-04-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8686543 | 3D chip package with shielded structures | Albert Bergemont, Uppili Sridhar, Joseph P. Ellul, Yi-Sheng Anthony Sun | 2014-04-01 |