Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967540 | Integrated circuit direct cooling systems having substrates in contact with a cooling medium | Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON +1 more | 2024-04-23 |
| 11610832 | Heat transfer for power modules | Jerome Teysseyre, Roveendra PAUL | 2023-03-21 |
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON +1 more | 2021-12-14 |
| 10665525 | Heat transfer for power modules | Jerome Teysseyre, Roveendra PAUL | 2020-05-26 |
| 10607919 | Semiconductor package having junction cooling pipes embedded in substrates | Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON +1 more | 2020-03-31 |