Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12262477 | Reprint apparatus for circuit board and reprint method using the same | Yong Gil Namgung, Jong-Hoon Shin, Sang Soon Choi, Young Chul AN | 2025-03-25 |
| 11387270 | Image sensor package including reflector | Byoung Heon Kim, Yong Gil Namgung, Jong Cheol Hong, Si Joong Yang | 2022-07-12 |
| 10667419 | Manufacturing method of an electronic component module | Eun Jung Jo, Jae Hyun Lim | 2020-05-26 |
| 10356911 | Electronic device module and method of manufacturing the same | Jae Hyun Lim, Jong In Ryu, Kyu Hwan Oh, Ki-ju Lee | 2019-07-16 |
| 10219380 | Electronic device module and manufacturing method thereof | Jae Hyun Lim, Kyu Hwan Oh, Jong In Ryu | 2019-02-26 |
| 10163746 | Semiconductor package with improved signal stability and method of manufacturing the same | Jong In Ryu, Ki Joo Sim, Ki-ju Lee, Jin Su Kim | 2018-12-25 |
| 10109595 | Double-sided package module and substrate strip | Hee Jung Jung, Jong In Ryu, Ki Joo Sim | 2018-10-23 |
| 9894790 | Electronic component module and manufacturing method thereof | Eun Jung Jo, Jae Hyun Lim | 2018-02-13 |
| 9748179 | Package and method of manufacturing the same | Kyu Hwan Oh, Jong In Ryu, Jae Hyun Lim | 2017-08-29 |
| 9633923 | Electronic device module and manufacturing method thereof | Jae Hyun Lim, Sun Ho Kim | 2017-04-25 |
| 9585260 | Electronic component module and manufacturing method thereof | Jae Hyun Lim, Jong In Ryu, Sun Ho Kim, Eun Jung Jo, Kyu Hwan Oh | 2017-02-28 |
| 9508565 | Semiconductor package and method of manufacturing the same | Jae Hyun Lim, Eun Jung Jo | 2016-11-29 |
| 9496219 | Semiconductor package including an antenna formed in a groove within a sealing element | Jung Ho Yoon, Chul Gyun Park, Myeong Woo Han, Jung Aun Lee | 2016-11-15 |
| 9343391 | Semiconductor package and method of manufacturing the same | Kyu Hwan Oh | 2016-05-17 |
| 9245858 | Semiconductor device package with integrated antenna for wireless applications | Myeong Woo Han, Jung Aun Lee, Jung Ho Yoon, Chul Gyun Park | 2016-01-26 |
| 9209114 | Power module package with a fastening unit including a non-conductive portion | Young Ki Lee, Bum Seok Suh, Joon Seok Chae | 2015-12-08 |
| 9209101 | Semiconductor package with a conductive shielding member | Young Do Kweon, Joon Seok Kang, Chang Bae Lee | 2015-12-08 |
| 9202798 | Power module package and method for manufacturing the same | Sun Woo Yun, Joon Seok Chae, Kwang Soo Kim | 2015-12-01 |
| 9123683 | Unit power module and power module package comprising the same | Tae Hyun Kim, Bum Seok Suh, Kwang Soo Kim | 2015-09-01 |
| 9105601 | Power module package | Tae Hyun Kim, Bum Seok Suh | 2015-08-11 |
| 9076660 | Power module package | Tae Hyun Kim, Kwang Soo Kim, Sun Woo Yun, Young Ki Lee | 2015-07-07 |
| 9048199 | Semiconductor package and method of manufacturing the semiconductor package | Jae-Cheon Doh | 2015-06-02 |
| 9030823 | Heat dissipation system for power module | Kwang Soo Kim, Young Ho Sohn, Bum Seok Suh, In Wha Jeong | 2015-05-12 |
| 8779580 | Electronic component package and manufacturing method thereof | Joon Seok Kang, Sung Yi, Jae-Cheon Doh, Sun-Kyong Kim, Jong Hwan Baek | 2014-07-15 |
| D708578 | Terminal pin | Sun Ho Kim, Kwang Soo Kim, Bum Seok Suh | 2014-07-08 |