Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749637 | Hybrid bonding interconnection using laser and thermal compression | Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju +1 more | 2023-09-05 |
| 9627348 | Laser assisted bonding for semiconductor die interconnections | Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon, Chan Ha Hwang +1 more | 2017-04-18 |
| 7030508 | Substrate for semiconductor package and wire bonding method using thereof | Doo Hyun Park, Ho Seok Kim | 2006-04-18 |