| 5401911 |
Via and pad structure for thermoplastic substrates and method and apparatus for forming the same |
Herbert R. Anderson, Jr., Arthur Bross, Julian G. Cempa, Robert O. Lussow, Thomas J. Walsh |
1995-03-28 |
| 5305523 |
Method of direct transferring of electrically conductive elements into a substrate |
Arthur Bross, Julian G. Cempa, Robert O. Lussow, James A. McDonald, Joseph D. Peruffo +1 more |
1994-04-26 |
| 5303862 |
Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures |
Arthur Bross, James J. Hedrick, Robert D. Johnson, Robert O. Lussow, James R. Lyerla, Jr. +3 more |
1994-04-19 |
| 5276964 |
Method of manufacturing a high density connector system |
Herbert R. Anderson, Jr., Arthur Bross, Julian G. Cempa, Robert O. Lussow, Thomas J. Walsh |
1994-01-11 |
| 5205738 |
High density connector system |
Herbert R. Anderson, Jr., Arthur Bross, Julian G. Cempa, Robert O. Lussow, Thomas J. Walsh |
1993-04-27 |
