Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450638 | Bump bond structure for enhanced electromigration performance | Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino +1 more | 2022-09-20 |
| 10763231 | Bump bond structure for enhanced electromigration performance | Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino +1 more | 2020-09-01 |