Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9873159 | Systems and methods for manufacturing diamond coated wires | Omid Rezvanian, Larry W. Shive, Rituraj Nandan, Edward Calvin | 2018-01-23 |
| 9499920 | Methods for producing rectangular seeds for ingot growth | Jihong John Chen, Susan S. Dwyer, Shawn Wesley Hayes, Thomas E. Doane, Linda K. Swiney +1 more | 2016-11-22 |
| 9111745 | Methods for producing rectangular seeds for ingot growth | Jihong John Chen, Susan S. Dwyer, Shawn Wesley Hayes, Thomas E. Doane, Linda K. Swiney +1 more | 2015-08-18 |
| 8900972 | Systems and methods for producing seed bricks | Jihong John Chen, Travis L. Hambach, Linda K. Swiney | 2014-12-02 |
| 8859393 | Methods for in-situ passivation of silicon-on-insulator wafers | Michael J. Ries, Anca Stefanescu, Andrew M. Jones | 2014-10-14 |
| 8845859 | Systems and methods for cleaving a bonded wafer pair | Michael J. Ries, Jeffrey L. Libbert | 2014-09-30 |
| 8367519 | Method for the preparation of a multi-layered crystalline structure | Jeffrey L. Libbert | 2013-02-05 |
| 6200908 | Process for reducing waviness in semiconductor wafers | Roland R. Vandamme, Ankur H. Desai, Yun-Biao Xin | 2001-03-13 |
| 6112738 | Method of slicing silicon wafers for laser marking | Tracy Michelle Ragan | 2000-09-05 |
| 6057170 | Method of measuring waviness in silicon wafers | — | 2000-05-02 |