| 9129972 |
Semiconductor package |
Young-Sang Cho, Dong-Han Kim, Ye-Chung Chung |
2015-09-08 |
| 8952510 |
Semiconductor chip and film and tab package comprising the chip and film |
Young-Sang Cho, Chang-Sig Kang, Yun-Seok Choi, Kyong-Soon Cho, Sang-Heui Lee |
2015-02-10 |
| 8575735 |
Semiconductor chip and film and TAB package comprising the chip and film |
Young-Sang Cho, Chang-Sig Kang, Yun-Seok Choi, Kyong-Soon Cho, Sang-Heul Lee |
2013-11-05 |
| 8222089 |
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same |
Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more |
2012-07-17 |
| 7915727 |
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same |
Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more |
2011-03-29 |
| 7339262 |
Tape circuit substrate and semiconductor apparatus employing the same |
Sa-Yoon Kang, Kwan-Jai Lee |
2008-03-04 |
| 7247936 |
Tape circuit substrate having wavy beam leads and semiconductor chip package using the same |
Jin Hyuk Lee, Kwan-Jai Lee |
2007-07-24 |
| 6902261 |
Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly |
Jeong-seon Kim, Seo-hyun Cho, Sa-Yoon Kang, Myung-song Jung |
2005-06-07 |
| 6818542 |
Tape circuit board and semiconductor chip package including the same |
Hyoung-Chan Chang |
2004-11-16 |
| 6737590 |
Tape circuit board and semiconductor chip package including the same |
Hyoung-Chan Chang |
2004-05-18 |
| 6421456 |
Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marks |
Youn Soo Lee, Byung-Man Kim |
2002-07-16 |
| 6103554 |
Method for packaging integrated circuits with elastomer chip carriers |
Youn Soo Lee, Byung-Man Kim |
2000-08-15 |
