Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7739791 | Method of producing an overmolded electronic module with a flexible circuit pigtail | Scott D. Brandenburg, Gary E. Oberlin | 2010-06-22 |
| 7603770 | Method of overmolding an electronic assembly having an insert-molded vertical mount connector header | Scott D. Brandenburg | 2009-10-20 |
| 7510108 | Method of making an electronic assembly | Daniel A. Lawlyes | 2009-03-31 |
| 7473585 | Technique for manufacturing an overmolded electronic assembly | Scott D. Brandenburg | 2009-01-06 |
| 7268429 | Technique for manufacturing an overmolded electronic assembly | Scott D. Brandenburg, Thomas A. Degenkolb, Matthew R. Walsh, Jeenhuei Tsai | 2007-09-11 |
| 7230829 | Overmolded electronic assembly with insert molded heat sinks | Larry M. Mandel | 2007-06-12 |
| 6905349 | Technique for connector to printed circuit board decoupling to eliminate flexure | Scott D. Brandenburg, Thomas A. Degenkolb, Larry M. Mandel, Richard D. Parker | 2005-06-14 |
| 6875636 | Wafer applied thermally conductive interposer | Scott D. Brandenburg | 2005-04-05 |