DL

Daniel A. Lawlyes

Delphi Technologies: 12 patents #195 of 4,124Top 5%
DE Delco Electronics: 3 patents #144 of 908Top 20%
Overall (All Time): #301,193 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7563992 Electronic enclosure with continuous ground contact surface Joseph M. Ratell 2009-07-21
7510108 Method of making an electronic assembly David A. Laudick 2009-03-31
7294007 Electronics enclosure and method of fabricating an electronics enclosure 2007-11-13
6998706 Relaxed tolerance flip chip assembly 2006-02-14
6821816 Relaxed tolerance flip chip assembly 2004-11-23
6822868 Heat sink with integrated electronics David Paul Buehler 2004-11-23
6626767 Apparatus for golf putting practice 2003-09-30
6565365 High density wirebond connector assembly 2003-05-20
6549426 Electronic enclosure with improved EMC performance Roy A. Visser 2003-04-15
6536286 Pressure sensor connector James I. Moyer, Joseph M. Ratell, Paul J. Pitzer, Perry L. Martinson, Steven T. Reyburn 2003-03-25
6447342 Pressure sensor connector Joseph M. Ratell 2002-09-10
6309224 High density wirebond connector assembly Jay Kelly, Anthony Raschilla 2001-10-30
6308725 Apparatus for controlling hydraulic fluid pressure Duane Zedric Collins 2001-10-30
5895883 Apparatus for dampening movement of passivation material in an electronic module Pardeep K. Bhatti, John A. Hearn, Jack Bednarz 1999-04-20
5359761 Method of making a header or housing for electrical connection to a hybrid circuit including an in-cavity trim of a terminal frame Duane Eugene Whitson 1994-11-01
5324890 Direct bond copper-output footprint 1994-06-28