Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5895883 | Apparatus for dampening movement of passivation material in an electronic module | Pardeep K. Bhatti, Jack Bednarz, Daniel A. Lawlyes | 1999-04-20 |
| 5492263 | Method for wire bonding an aluminum wire to a lead of an electronics package | Mark E. Webster, Daniel R. Bellus, Steven Michael Stansberry, Steven A. Middleton, Ronald D. Myer +1 more | 1996-02-20 |
| 5475567 | Method for hermetically sealing a single layer ceramic thick film electronic module | — | 1995-12-12 |
| 5263880 | Wirebond pin-plastic header combination and methods of making and using the same | Dwight L. Schwarz, Mark E. Webster, Gregory L. Hall | 1993-11-23 |
| 5233871 | Hybrid accelerometer assembly | Dwight L. Schwarz, William M. Maki, Glen R. Puterbaugh | 1993-08-10 |
| 5176853 | Controlled adhesion conductor | Dwadasi H. R. Sarma, Ponnusamy Palanisamy, Dwight L. Schwarz | 1993-01-05 |
| 5122929 | Method of achieving selective inhibition and control of adhesion in thick-film conductors | Ponnusamy Palanisamy, Dwadasi H. R. Sarma, Dwight L. Schwarz | 1992-06-16 |
| 5121298 | Controlled adhesion conductor | Dwadasi H. R. Sarma, Ponnusamy Palanisamy, Dwight L. Schwarz | 1992-06-09 |
| 4959751 | Ceramic hybrid integrated circuit having surface mount device solder stress reduction | Dwight L. Schwarz, Dwadasi H. R. Sarma, Ponnusamy Palanisamy | 1990-09-25 |