| 5895883 |
Apparatus for dampening movement of passivation material in an electronic module |
Pardeep K. Bhatti, Jack Bednarz, Daniel A. Lawlyes |
1999-04-20 |
| 5492263 |
Method for wire bonding an aluminum wire to a lead of an electronics package |
Mark E. Webster, Daniel R. Bellus, Steven Michael Stansberry, Steven A. Middleton, Ronald D. Myer +1 more |
1996-02-20 |
| 5475567 |
Method for hermetically sealing a single layer ceramic thick film electronic module |
— |
1995-12-12 |
| 5263880 |
Wirebond pin-plastic header combination and methods of making and using the same |
Dwight L. Schwarz, Mark E. Webster, Gregory L. Hall |
1993-11-23 |
| 5233871 |
Hybrid accelerometer assembly |
Dwight L. Schwarz, William M. Maki, Glen R. Puterbaugh |
1993-08-10 |
| 5176853 |
Controlled adhesion conductor |
Dwadasi H. R. Sarma, Ponnusamy Palanisamy, Dwight L. Schwarz |
1993-01-05 |
| 5122929 |
Method of achieving selective inhibition and control of adhesion in thick-film conductors |
Ponnusamy Palanisamy, Dwadasi H. R. Sarma, Dwight L. Schwarz |
1992-06-16 |
| 5121298 |
Controlled adhesion conductor |
Dwadasi H. R. Sarma, Ponnusamy Palanisamy, Dwight L. Schwarz |
1992-06-09 |
| 4959751 |
Ceramic hybrid integrated circuit having surface mount device solder stress reduction |
Dwight L. Schwarz, Dwadasi H. R. Sarma, Ponnusamy Palanisamy |
1990-09-25 |