Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ceramic hybrid integrated circuit having surface mount device solder stress reduction

Ceramic hybrid integrated circuit having surface mount device solder stress reduction

US Patent 4959751 · Granted Sep 25, 1990

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and apparatus for high frequency impact testing2011
Low-cost circuit board materials and processes for area array electrical interco2011
Thermal management in electronic displays2010
Low-cost circuit board materials and processes for area array electrical interco2010
Woven electronic textile, yarn and article2009
Thermal management of surface-mount circuit devices on laminate ceramic substrat2007
Hearing aid with large diaphragm microphone element including a printed circuit 2007
Fabrication of thick film electrical components2006
Interconnecting large area display panels2006
Hearing aid with large diaphragm microphone element including a printed circuit 2006
Low-cost circuit board materials and processes for area array electrical interco2005
Thermal management in electronic displays2005