Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for wire bonding an aluminum wire to a lead of an electronics package

Method for wire bonding an aluminum wire to a lead of an electronics package

US Patent 5492263 · Granted Feb 20, 1996

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Testing apparatus for testing lead acid batteries and their components, and meth2023
Methods for preparing SGLT2 inhibitors2017
Electronic module2004
Method for integrated circuit packaging2002
Process for preventing the formation of a copper precipitate in a copper-contain2002
Apparatus for dampening movement of passivation material in an electronic module1999
Method for hermetically sealing a single layer ceramic thick film electronic mod1995
Liquid crystal polymer encapsulated electronic devices and methods of making the1995
Wirebond pin-plastic header combination and methods of making and using the same1993
Wirebond pin-plastic header combination and methods of making and using the same1993
Wirebond pin-plastic header combination and methods of making and using the same1993
Hybrid accelerometer assembly1993