Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376375 | Process for preventing the formation of a copper precipitate in a copper-containing metallization on a die | Melody G Hewitt-Bell | 2002-04-23 |
| 5492263 | Method for wire bonding an aluminum wire to a lead of an electronics package | Mark E. Webster, John A. Hearn, Daniel R. Bellus, Steven A. Middleton, Ronald D. Myer +1 more | 1996-02-20 |