Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784137 | Package assembly for thin wafer shipping and method of use | Charles F. Musante | 2020-09-22 |
| 10622235 | Package assembly for thin wafer shipping and method of use | Charles F. Musante | 2020-04-14 |
| 10468280 | Package assembly for thin wafer shipping and method of use | Charles F. Musante | 2019-11-05 |
| 10192748 | Controlling of etch depth in deep via etching processes and resultant structures | Timothy C. Krywanczyk, Patrick A. Raymond, John C. S. Hall | 2019-01-29 |
| 10090180 | Package assembly for thin wafer shipping and method of use | Charles F. Musante | 2018-10-02 |
| 9543175 | Package assembly for thin wafer shipping and method of use | Charles F. Musante | 2017-01-10 |
| 8912091 | Backside metal ground plane with improved metal adhesion and design structures | Jay Burnham, George A. Dunbar, III, Jeffrey P. Gambino, John C. Hall, Kenneth F. McAvey, Jr. +2 more | 2014-12-16 |