Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183594 | Semiconductor device with tiered pillar and manufacturing method thereof | Ronald Patrick Huemoeller, Michael Kelly | 2024-12-31 |
| 12035472 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2024-07-09 |
| 12015000 | Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof | Bora Baloglu, Ron Huemoeller | 2024-06-18 |
| 11948808 | Semiconductor device and manufacturing method thereof | Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki +6 more | 2024-04-02 |
| 11942581 | Semiconductor device with transmissive layer and manufacturing method thereof | David Clark | 2024-03-26 |
| 11901343 | Semiconductor device with integrated heat distribution and manufacturing method thereof | Bora Baloglu, Ron Huemoeller | 2024-02-13 |
| 11823913 | Method of manufacturing an electronic device and electronic device manufactured thereby | Bora Baloglu, Ronald Patrick Huemoeller | 2023-11-21 |
| 11700692 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2023-07-11 |
| 11444013 | Semiconductor device and manufacturing method thereof | Bora Baloglu, Ron Huemoeller | 2022-09-13 |
| 11437552 | Semiconductor device with transmissive layer and manufacturing method thereof | David Clark | 2022-09-06 |
| 11195726 | Semiconductor device and manufacturing method thereof | Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki +6 more | 2021-12-07 |
| 11089685 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2021-08-10 |
| 11031256 | Semiconductor device with tiered pillar and manufacturing method thereof | Ronald Patrick Huemoeller, Michael Kelly | 2021-06-08 |
| 11031259 | Method of manufacturing an electronic device and electronic device manufactured thereby | Bora Baloglu, Ronald Patrick Huemoeller | 2021-06-08 |
| 11018102 | Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof | Bora Baloglu, Ron Huemoeller | 2021-05-25 |
| 10985146 | Semiconductor device with integrated heat distribution and manufacturing method thereof | Bora Baloglu, Ron Huemoeller | 2021-04-20 |
| 10790161 | Electronic device with adaptive vertical interconnect and fabricating method thereof | Bora Baloglu, Ronald Patrick Huemoeller | 2020-09-29 |
| 10784422 | Semiconductor device with optically-transmissive layer and manufacturing method thereof | David Clark | 2020-09-22 |
| 10748786 | Semiconductor device with tiered pillar and manufacturing method thereof | Ronald Patrick Huemoeller, Michael Kelly | 2020-08-18 |
| 10553451 | Semiconductor device and manufacturing method thereof | Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki +6 more | 2020-02-04 |
| 10548221 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2020-01-28 |
| 10504827 | Semiconductor device and manufacturing method thereof | Bora Baloglu, Ron Huemoeller | 2019-12-10 |
| 10490716 | Semiconductor device with optically-transmissive layer and manufacturing method thereof | David Clark | 2019-11-26 |
| 10468272 | Method of manufacturing an electronic device and electronic device manufactured thereby | Bora Baloglu, Ronald Patrick Huemoeller | 2019-11-05 |
| 10438910 | Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof | Bora Baloglu, Ron Huemoeller | 2019-10-08 |