Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11261305 | Thermosetting resin composition, prepreg, laminate, and printed circuit board | Guangbin Chen, Qianfa Liu, Shanyin YAN, Xianping Zeng | 2022-03-01 |
| 11053352 | Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit board | Guangbin Chen, Qianfa Liu, Shanyin YAN, Xianping Zeng | 2021-07-06 |
| 10208188 | Thermosetting resin composition and uses thereof | Liangpeng HAO, Songgang Chai | 2019-02-19 |
| 10053547 | Thermosetting resin composition and uses thereof | Songgang Chai | 2018-08-21 |
| 9475970 | Epoxy resin composition and copper clad laminate manufactured by using same | Songgang Chai, Zhongqiang Yang | 2016-10-25 |