Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424450 | Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same | Andrew Hoetker, Ryan Sanden, Paul R. Hoffman, Timothy L. Olson | 2025-09-23 |
| 12381154 | Fully molded bridge interposer and method of making the same | Timothy L. Olson, Clifford Sandstrom | 2025-08-05 |
| 12334396 | Unit specific variable or adaptive metal fill and system and method for the same | David Ryan Bartling, Timothy L. Olson | 2025-06-17 |
| 12261140 | Stackable fully molded semiconductor structure with vertical interconnects | Timothy L. Olson, Edward Hudson | 2025-03-25 |
| 12205881 | Semiconductor assembly comprising a 3D block and method of making the same | Timothy L. Olson, Robin Davis, Paul R. Hoffman | 2025-01-21 |
| 12170261 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Timothy L. Olson, Clifford Sandstrom, Paul R. Hoffman | 2024-12-17 |
| 12057373 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same | Timothy L. Olson, Clifford Sandstrom, Robin Davis | 2024-08-06 |
| 11973051 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Timothy L. Olson, Clifford Sandstrom, Paul R. Hoffman | 2024-04-30 |
| 11887862 | Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL | David Ryan Bartling, Timothy L. Olson | 2024-01-30 |
| 11791207 | Unit specific variable or adaptive metal fill and system and method for the same | David Ryan Bartling, Timothy L. Olson | 2023-10-17 |
| 11728248 | Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Robin Davis, Timothy L. Olson, Clifford Sandstrom | 2023-08-15 |
| 11664321 | Multi-step high aspect ratio vertical interconnect and method of making the same | Clifford Sandstrom, Timothy L. Olson | 2023-05-30 |
| 11616003 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Timothy L. Olson, Clifford Sandstrom, Robin Davis | 2023-03-28 |
| 11538759 | Fully molded bridge interposer and method of making the same | Timothy L. Olson, Clifford Sandstrom | 2022-12-27 |
| 11444051 | Fully molded semiconductor structure with face mounted passives and method of making the same | Clifford Sandstrom, Benedict San Jose, Timothy L. Olson | 2022-09-13 |
| 11056453 | Stackable fully molded semiconductor structure with vertical interconnects | Timothy L. Olson, Edward Hudson | 2021-07-06 |
| 10672624 | Method of making fully molded peripheral package on package device | Christopher M. Scanlan, William Boyd Rogers | 2020-06-02 |
| 10573601 | Semiconductor device and method of unit specific progressive alignment | Christopher M. Scanlan | 2020-02-25 |
| 10157803 | Semiconductor device and method of unit specific progressive alignment | Christopher M. Scanlan | 2018-12-18 |
| 10056304 | Automated optical inspection of unit specific patterning | Vaibhav Joga Singh Bora, Christopher M. Scanlan, Timothy L. Olson | 2018-08-21 |
| 10050004 | Fully molded peripheral package on package device | Christopher M. Scanlan, William Boyd Rogers | 2018-08-14 |
| 9978655 | Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping | Christopher M. Scanlan | 2018-05-22 |
| 9818659 | Multi-die package comprising unit specific alignment and unit specific routing | — | 2017-11-14 |
| 9754835 | Semiconductor device and method comprising redistribution layers | Christopher M. Scanlan | 2017-09-05 |
| 9613830 | Fully molded peripheral package on package device | Christopher M. Scanlan, William Boyd Rogers | 2017-04-04 |