Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424527 | Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages | Timothy L. Olson, Paul R. Hoffman | 2025-09-23 |
| 12381154 | Fully molded bridge interposer and method of making the same | Timothy L. Olson, Craig Bishop | 2025-08-05 |
| 12300561 | Fully molded structure with multi-height components comprising backside conductive material and method for making the same | Paul R. Hoffman, Robin Davis, Timothy L. Olson | 2025-05-13 |
| 12170261 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Timothy L. Olson, Craig Bishop, Paul R. Hoffman | 2024-12-17 |
| 12057373 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same | Timothy L. Olson, Craig Bishop, Robin Davis | 2024-08-06 |
| 11973051 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Timothy L. Olson, Craig Bishop, Paul R. Hoffman | 2024-04-30 |
| 11749534 | Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same | Robin Davis, Paul R. Hoffman, Timothy L. Olson | 2023-09-05 |
| 11728248 | Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Robin Davis, Timothy L. Olson, Craig Bishop | 2023-08-15 |
| 11664321 | Multi-step high aspect ratio vertical interconnect and method of making the same | Craig Bishop, Timothy L. Olson | 2023-05-30 |
| 11616003 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects | Timothy L. Olson, Craig Bishop, Robin Davis | 2023-03-28 |
| 11538759 | Fully molded bridge interposer and method of making the same | Timothy L. Olson, Craig Bishop | 2022-12-27 |
| 11444051 | Fully molded semiconductor structure with face mounted passives and method of making the same | Benedict San Jose, Timothy L. Olson, Craig Bishop | 2022-09-13 |
| 7352444 | Method for arranging and rotating a semiconductor wafer within a photolithography tool prior to exposing the wafer | Christopher A. Seams, Yonghong Yang, Prakash R. Krishanan | 2008-04-01 |