CY

Chan Min Yu

Micron: 16 patents #1,043 of 6,345Top 20%
RR Round Rock Research: 2 patents #110 of 239Top 50%
TI Texas Instruments: 2 patents #5,248 of 12,488Top 45%
Overall (All Time): #224,300 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8637973 Packaged microelectronic components with terminals exposed through encapsulant Eng Meow Koon, Low Siu Waf, Chia Yong Poo, Ser Bok Leng, Zhou Wei 2014-01-28
8138617 Apparatus and method for packaging circuits Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Neo Yong Loo, Eng Meow Koon +4 more 2012-03-20
8115306 Apparatus and method for packaging circuits Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Neo Yong Lou, Eng Meow Koon +4 more 2012-02-14
7675169 Apparatus and method for packaging circuits Chia Yong Poo, Boon Suan Jeung, Low Waf, Neo Yong Loo, Eng Meow Koon +4 more 2010-03-09
7358154 Method for fabricating packaged die Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Neo Yong Loo, Eng Meow Koon +4 more 2008-04-15
7285850 Support elements for semiconductor devices with peripherally located bond pads Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Neo Yong Loo, Chua Swee Kwang 2007-10-23
7226809 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods Chia Yong Poo, Boon Suan Jeung, Chua Swee Kwang, Low Siu Waf, Neo Yong Loo 2007-06-05
7195957 Packaged microelectronic components Eng Meow Koon, Low Siu Waf, Chia Yong Poo, Ser Bok Leng, Zhou Wei 2007-03-27
7170161 In-process semiconductor packages with leadframe grid arrays Ser Bok Leng, Low Siu Waf, Chia Yong Poo, Eng Meow Koon 2007-01-30
7115984 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Neo Yong Loo, Chua Swee Kwang 2006-10-03
6967127 Methods for making semiconductor packages with leadframe grid arrays Ser Bok Leng, Low Siu Waf, Chia Yong Poo, Eng Meow Koon 2005-11-22
6894386 Apparatus and method for packaging circuits Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Neo Yong Loo, Eng Meow Koon +4 more 2005-05-17
6836008 Semiconductor packages with leadframe grid arrays and components Ser Bok Leng, Low Siu Waf, Chia Yong Poo, Eng Meow Koon 2004-12-28
6836009 Packaged microelectronic components Eng Meow Koon, Low Siu Waf, Chia Yong Poo, Ser Bok Leng, Zhou Wei 2004-12-28
6818977 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages Chia Yong Poo, Boon Suan Jeung, Chua Swee Kwang, Low Siu Waf, Neo Yong Loo 2004-11-16
6727116 Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Neo Yong Loo, Chua Swee Kwang 2004-04-27
6611052 Wafer level stackable semiconductor package Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Neo Yong Loo, Chua Swee Kwang 2003-08-26
6582992 Stackable semiconductor package and wafer level fabrication method Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Neo Yong Loo, Chua Swee Kwang 2003-06-24
5663105 Semiconductor device package side-by-side stacking and mounting system Goh Jing Sua 1997-09-02
5619067 Semiconductor device package side-by-side stacking and mounting system Goh Jing Sua 1997-04-08