Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6089095 | Method and apparatus for nondestructive inspection and defect detection in packaged integrated circuits | Ji Cheng Yang | 2000-07-18 |
| 5663105 | Semiconductor device package side-by-side stacking and mounting system | Chan Min Yu | 1997-09-02 |
| 5619067 | Semiconductor device package side-by-side stacking and mounting system | Chan Min Yu | 1997-04-08 |