Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8173948 | Optical coupling apparatus for a dual column charged particle beam tool for imaging and forming silicide in a localized manner | — | 2012-05-08 |
| 7884024 | Apparatus and method for optical interference fringe based integrated circuit processing | Erwan Le Roy, Theodore Lundquist, Rajesh Jain | 2011-02-08 |
| 7697146 | Apparatus and method for optical interference fringe based integrated circuit processing | Erwan Le Roy, Theodore Lundquist | 2010-04-13 |
| 7612321 | Optical coupling apparatus for a dual column charged particle beam tool for imaging and forming silicide in a localized manner | — | 2009-11-03 |
| 7439168 | Apparatus and method of forming silicide in a localized manner | Christian Boit, Theodore Lundquist, Uwe Kerst, Stephan Schoemann, Peter Sadewater | 2008-10-21 |
| 7245133 | Integration of photon emission microscope and focused ion beam | Eugene A. Delenia | 2007-07-17 |
| 7036109 | Imaging integrated circuits with focused ion beam | Theodore Lundquist, William B. Thompson, Erwan Le Roy, Eugene A. Delenia | 2006-04-25 |
| 6955930 | Method for determining thickness of a semiconductor substrate at the floor of a trench | Erwan Le Roy | 2005-10-18 |
| 6939209 | Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuits | John Valliant | 2005-09-06 |
| 6872581 | Measuring back-side voltage of an integrated circuit | Christopher Shaw, Theodore Lundquist | 2005-03-29 |
| 6672947 | Method for global die thinning and polishing of flip-chip packaged integrated circuits | John Valliant | 2004-01-06 |
| 6252222 | Differential pulsed laser beam probing of integrated circuits | Steven Kasapi, Seema Somani | 2001-06-26 |