Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272712 | Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region | Tsang-Yu Liu, Shu-Ming Chang | 2025-04-08 |
| 12237354 | Chip package and method for forming the same | Tsang-Yu Liu, Shu-Ming Chang | 2025-02-25 |
| 11746003 | Chip package | Tsang-Yu Liu, Shu-Ming Chang | 2023-09-05 |
| 11319208 | Chip package and manufacturing method thereof | Tsang-Yu Liu, Shu-Ming Chang | 2022-05-03 |
| 10461117 | Semiconductor structure and method for manufacturing semiconductor structure | Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin | 2019-10-29 |
| 9997473 | Chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin | 2018-06-12 |