Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281290 | Bond head for thermal compression die bonding | Kin Yik Hung, Pak Kin Leung, Cheuk Wah Tang, Gary Peter Widdowson | 2016-03-08 |
| 7830597 | Optical system having selectable field for inspection | Siu Wing LAU, Zhuan Yun Zhang, Yiu Ming Cheung | 2010-11-09 |