| 11967540 |
Integrated circuit direct cooling systems having substrates in contact with a cooling medium |
Seungwon IM, Oseob Jeon, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more |
2024-04-23 |
| 11201105 |
Semiconductor package having a spacer with a junction cooling pipe |
Seungwon IM, Oseob Jeon, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more |
2021-12-14 |
| 11031379 |
Stray inductance reduction in packaged semiconductor devices |
Seungwon IM, Oseob Jeon |
2021-06-08 |
| 10607919 |
Semiconductor package having junction cooling pipes embedded in substrates |
Seungwon IM, Oseob Jeon, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more |
2020-03-31 |
| 10090279 |
Stray inductance reduction in packaged semiconductor devices and modules |
Seungwon IM, Mankyo Jong, Joonseo SON, Oseob Jeon |
2018-10-02 |