Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7741161 | Method of making integrated circuit package with transparent encapsulant | Ah Lek Khor, Kock Huat Lee, Min Kong Thum, Hong Mun Tung, Mun Tuck Cheong | 2010-06-22 |
| 6068809 | Method of injection molding elements such as semiconductor elements | Eugene Chen, Hohn Jong Hsiung, Kuang Hann Lin, Wing Lun Wong | 2000-05-30 |
| 5698242 | Apparatus for the injection molding of semiconductor elements | Eugene Chen, Hohn Jong Hsiung, Kuang Hann Lin, Wing Lun Wong | 1997-12-16 |
| 5301720 | Method for use in the manufacture of semiconductor devices and apparatus for use in connection with the method | Lawrence L. Plummer, Jr., See-Lian Gan, Hok-Ming Chan | 1994-04-12 |