Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7741161 | Method of making integrated circuit package with transparent encapsulant | Ah Lek Khor, Kock Huat Lee, Boon Meng Chan, Hong Mun Tung, Mun Tuck Cheong | 2010-06-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7741161 | Method of making integrated circuit package with transparent encapsulant | Ah Lek Khor, Kock Huat Lee, Boon Meng Chan, Hong Mun Tung, Mun Tuck Cheong | 2010-06-22 |