MC

Mun Tuck Cheong

CB Carsem (M) Sdn. Bhd.: 1 patents #23 of 49Top 50%
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Patent #TitleCo-InventorsDate
7741161 Method of making integrated circuit package with transparent encapsulant Ah Lek Khor, Kock Huat Lee, Boon Meng Chan, Min Kong Thum, Hong Mun Tung 2010-06-22