Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8796840 | Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers | Wan-Lan Chiang, Chih-Ping Peng | 2014-08-05 |
| 8252633 | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof | Wan-Lan Chiang, Chih-Ping Peng | 2012-08-28 |
| 8138597 | Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer | Wan-Lan Chiang, Chih-Ping Peng | 2012-03-20 |
| 7915728 | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof | Wan-Lan Chiang, Chih-Ping Peng | 2011-03-29 |
| 7838985 | Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers | Wan-Lan Chiang, Chih-Ping Peng | 2010-11-23 |
| 6927094 | Method for assembling a semiconductor chip utilizing conducting bars rather than bonding wires | Max Chen, Ching-Lu Hsu, Yan Man Tsui | 2005-08-09 |
| 6576985 | Semiconductor device packaging assembly | Max Chen, Ching-Lu Hsu, Yan Man Tsui | 2003-06-10 |
| 6068809 | Method of injection molding elements such as semiconductor elements | Eugene Chen, Hohn Jong Hsiung, Wing Lun Wong, Boon Meng Chan | 2000-05-30 |
| 5698242 | Apparatus for the injection molding of semiconductor elements | Eugene Chen, Hohn Jong Hsiung, Wing Lun Wong, Boon Meng Chan | 1997-12-16 |