Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D903831 | Fitting | Daniel George Harper, Pitt Chang | 2020-12-01 |
| D903832 | Fitting | Daniel George Harper, Pitt Chang | 2020-12-01 |
| D903061 | Fitting | Daniel George Harper, Pitt Chang | 2020-11-24 |
| D903062 | Fitting | Daniel George Harper, Pitt Chang | 2020-11-24 |
| 6068809 | Method of injection molding elements such as semiconductor elements | Hohn Jong Hsiung, Kuang Hann Lin, Wing Lun Wong, Boon Meng Chan | 2000-05-30 |
| 5817220 | Electroplating apparatus | — | 1998-10-06 |
| 5698242 | Apparatus for the injection molding of semiconductor elements | Hohn Jong Hsiung, Kuang Hann Lin, Wing Lun Wong, Boon Meng Chan | 1997-12-16 |
| 5342797 | Method for forming a vertical power MOSFET having doped oxide side wall spacers | Steven Sapp, Neil Wylie | 1994-08-30 |