Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6881673 | Integrated deposition process for copper metallization | Peijun Ding, Imran Hashim, Barry Chin | 2005-04-19 |
| 6566259 | Integrated deposition process for copper metallization | Peijun Ding, Imran Hashim, Barry Chin | 2003-05-20 |
| 6488823 | Stress tunable tantalum and tantalum nitride films | Tony P. Chiang, Peijun Ding, Barry Chin | 2002-12-03 |
| 6387805 | Copper alloy seed layer for copper metallization | Peijun Ding, Tony P. Chiang, Imran Hashim, Barry Chin | 2002-05-14 |
| 6313033 | Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications | Tony P. Chiang, Suraj Rengarajan, Peijun Ding, Barry Chin | 2001-11-06 |
| 6217715 | Coating of vacuum chambers to reduce pump down time and base pressure | Imran Hashim | 2001-04-17 |
| 6174811 | Integrated deposition process for copper metallization | Peijun Ding, Imran Hashim, Barry Chin | 2001-01-16 |
| 6160315 | Copper alloy via structure | Tony P. Chiang, Peijun Ding, Barry Chin, Imran Hashim | 2000-12-12 |
| 6066892 | Copper alloy seed layer for copper metallization in an integrated circuit | Peijun Ding, Tony P. Chiang, Imran Hashim, Barry Chin | 2000-05-23 |
| 6037257 | Sputter deposition and annealing of copper alloy metallization | Tony P. Chiang, Peijun Ding, Barry Chin, Imran Hashim | 2000-03-14 |