Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100644 | Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate via | Thomas Bodner, Joerg Siegert | 2024-09-24 |
| 10468541 | Semiconductor device with through-substrate via and corresponding method of manufacture | Franz Schrank, Sara Carniello, Hubert Enichlmair, Jochen Kraft, Rainer Holzhaider | 2019-11-05 |
| 10062610 | Method of producing an opening with smooth vertical sidewall in a semiconductor substrate | Guenther KOPPITSCH | 2018-08-28 |
| 8063458 | Micromechanical component, method for fabrication and use | Franz Schrank | 2011-11-22 |
| 7629628 | Bipolar transistor including a base layer containing carbon atoms and having three distinct layers being doped with a trivalent substance | Jochen Kraft, Georg Roehrer | 2009-12-08 |