Issued Patents All Time
Showing 1–25 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394692 | Power circuit module | Chee Hiong CHEW, Olaf Zschieschang | 2025-08-19 |
| 12362266 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2025-07-15 |
| 12355009 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2025-07-08 |
| 12347812 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2025-07-01 |
| 12347755 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2025-07-01 |
| 12308297 | Semiconductor package system and related methods | Yushuang YAO, Chee Hiong CHEW | 2025-05-20 |
| 12300558 | Substrates and related methods | Chee Hiong CHEW, Yushuang YAO, Vemmond Jeng Hung NG | 2025-05-13 |
| 12283562 | Clip design and method of controlling clip position | Chee Hiong CHEW, Vemmond Jeng Hung NG | 2025-04-22 |
| 12211775 | Multiple substrate package systems and related methods | Chee Hiong CHEW, Yusheng LIN | 2025-01-28 |
| 12033904 | Semiconductor package system and related methods | Yushuang YAO, Chee Hiong CHEW | 2024-07-09 |
| 11955412 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2024-04-09 |
| 11948870 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2024-04-02 |
| 11908840 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2024-02-20 |
| 11894347 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2024-02-06 |
| 11804421 | Connecting clip design for pressure sintering | Chee Hiong CHEW, Yushuang YAO | 2023-10-31 |
| 11710687 | Semiconductor package with guide pin | Chee Hiong CHEW, Yushuang YAO, Chuncao NIU | 2023-07-25 |
| 11672087 | Semiconductor package | Yushuang YAO, Chee Hiong CHEW | 2023-06-06 |
| 11469163 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2022-10-11 |
| 11462515 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2022-10-04 |
| 11452225 | Fin frame assemblies | Chee Hiong CHEW, Yushuang YAO | 2022-09-20 |
| 11374373 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Yusheng LIN | 2022-06-28 |
| 11342237 | Semiconductor package system and related methods | Yushuang YAO, Chee Hiong CHEW | 2022-05-24 |
| 11272625 | Method for forming a semiconductor package | Chee Hiong CHEW, Yushuang YAO | 2022-03-08 |
| 11217506 | Semiconductor device assemblies including low-stress spacer | Chee Hiong CHEW | 2022-01-04 |
| 11081828 | Power module housing | Jihwan Kim, Yushuang YAO, Bosung WON, Olaf Zschieschang | 2021-08-03 |