| 10615071 |
Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method |
David J. Howard |
2020-04-07 |
| 10615072 |
Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method |
David J. Howard |
2020-04-07 |
| 9887123 |
Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method |
David J. Howard |
2018-02-06 |
| 9458011 |
Scalable self-supported MEMS structure and related method |
David J. Howard, Michael J. DeBar, Jeff Rose |
2016-10-04 |
| 9377350 |
Light sensor with chemically resistant and robust reflector stack |
David J. Howard, Jeff Rose, Michael J. DeBar |
2016-06-28 |
| 9346669 |
Robust MEMS structure with via cap and related method |
David J. Howard, Michael J. DeBar, Jeff Rose |
2016-05-24 |
| 9136157 |
Deep N wells in triple well structures |
Marco Racanelli, Jinshu Zhang |
2015-09-15 |
| 9105681 |
Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation |
Volker Blaschke, Todd Thibeault, Chris Cureton, Paul D. Hurwitz, David J. Howard +1 more |
2015-08-11 |
| 8598713 |
Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation |
Volker Blaschke, Todd Thibeault, Chris Cureton, Paul D. Hurwitz, David J. Howard +1 more |
2013-12-03 |
| 8212331 |
Method for fabricating a backside through-wafer via in a processed wafer and related structure |
Marco Racanelli, David J. Howard |
2012-07-03 |
| 8098351 |
Self-planarized passivation dielectric for liquid crystal on silicon structure and related method |
— |
2012-01-17 |
| 7897484 |
Fabricating a top conductive layer in a semiconductor die |
Marco Racanelli, David J. Howard |
2011-03-01 |
| 7772673 |
Deep trench isolation and method for forming same |
Kevin Q. Yin, Amol Kalburge, David J. Howard, Dieter Dornisch |
2010-08-10 |
| 7704874 |
Method for fabricating a frontside through-wafer via in a processed wafer and related structure |
Marco Racanelli, David J. Howard |
2010-04-27 |
| 7589009 |
Method for fabricating a top conductive layer in a semiconductor die and related structure |
Marco Racanelli, David J. Howard |
2009-09-15 |
| 7078310 |
Method for fabricating a high density composite MIM capacitor with flexible routing in semiconductor dies |
Marco Racanelli, Paul Kempf |
2006-07-18 |
| 7052966 |
Deep N wells in triple well structures and method for fabricating same |
Marco Racanelli, Jinshu Zhang |
2006-05-30 |
| 7041569 |
Method for fabricating a high density composite MIM capacitor with reduced voltage dependence in semiconductor dies |
Marco Racanelli, David J. Howard |
2006-05-09 |
| 6777777 |
High density composite MIM capacitor with flexible routing in semiconductor dies |
Marco Racanelli, Paul Kempf |
2004-08-17 |
| 6680521 |
High density composite MIM capacitor with reduced voltage dependence in semiconductor dies |
Marco Racanelli, David J. Howard |
2004-01-20 |
| 6430028 |
Method for fabrication of an MIM capacitor and related structure |
Marco Racanelli |
2002-08-06 |
| 6411492 |
Structure and method for fabrication of an improved capacitor |
Phil N. Sherman |
2002-06-25 |